DEGSON at CIIF 2026: Advancing Industrial Connectivity & Automation
Release time ： 2026-09-29
Author：Degson Technical team
DEGSON is excited to participate in the 2026 China International Industry Fair, bringing our full portfolio of industrial connectivity products, innovative technologies, and customized solutions to one
of the industry’s most important annual events.
Booth: Hall 5.1, A110, National Exhibition and Convention Center, Shanghai
Date: October 12–16, 2026
Our exhibition highlights include:
15EDGKNH-2.54 High-Density Series – compact design for modular and space-saving applications
9EDGCP Crimp-Type Pluggable Connectors – enhanced vibration resistance for signal and low-power circuits
DS Series DIN Rail Terminal Blocks – supporting 0.25–16 mm² conductors with modular expansion
DMCB1 Miniature Circuit Breakers – rated up to 63A with B/C/D tripping curves
Circular Data Connectors – M12 D/X-coded and RJ45 series supporting Industrial Ethernet
Energy Storage Connectors – covering liquid-cooled systems, communication links, and MSD solutions
EV Charging Connectors & Inlets – IP67 protection with stable thermal performance
If you are attending CIIF 2026, we would be glad to meet you at Booth A110, Hall 5.1 to explore how DEGSON can support your next industrial connectivity project.
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