What are the solutions for high-density terminal blocks in I/O modules?
Solutions for High-Density Terminal Blocks in I/O Modules
As the integration density of industrial control cabinets continues to increase, remote I/O modules are evolving toward miniaturization and higher channel counts, making high-density wiring a core pain point in hardware design. DEGSON specializes in the R&D and manufacturing of industrial terminal blocks and DIN-rail I/O housings, and has long served manufacturers of distributed bus I/O and automation control equipment. Leveraging its advantage in the collaborative development of housings and terminal blocks, DEGSON has introduced two mature terminal matching solutions, each tailored to different product positioning. These solutions provide one-stop structural matching and selection for I/O devices, effectively shortening customers' development cycles.
Integrated Built-in IO Terminal Solution
DF760 series IO housings feature an integrated terminal blocks and housing design for 8-channel (DF760-200) and 18-channel (DF760-300) configurations. A dual-row, high-density layout maximizes the use of the housing's front-facing space, controlling module width and enabling compact cabinet installation.
The terminal employ a push-in spring connection method, supporting 0.2–1.5 mm² cables and rated at 150 V / 8 A, meeting the signal transmission requirements of both digital and analog signals.
The housing features pre-set terminal mounting positions; after the PCB is installed into the housing, the IO terminals are simply inserted, eliminating the need for a separate terminal assembly process and improving PCB production efficiency. Uniform exterior styling and terminal color coordination ensure overall visual consistency, making this solution ideal for standardized mass production of small to medium-sized multi-channel IO modules.
The modules support tight side-by-side DIN-rail mounting and are widely used in various in-cabinet distributed IO products.
Pluggable Terminal Blocks Solution
This series includes multiple models such as 15EDGKNH-3.5, 15EDGKNHM-3.5, and 15EDGKNHG-3.5, featuring a 3.5 mm pitch dual-row structure that exponentially increases wiring point density within a limited width.
The products employ a male/female mating structure: the socket is soldered onto the PCB, while the plug can be pre-wired. During equipment commissioning or on-site maintenance, the cables and the IO module can be quickly separated without removing individual wires, offering significant maintenance convenience.
The solution utilizes a tool-free push-in spring structure, enabling fast wiring without a screwdriver. The terminals hold authoritative UL and VDE certifications.
Customers can independently plan the housing cutout layout and flexibly adjust channel allocation.
Complementary Advantages of the Two Solutions
The DF760 integrated solution focuses on mass production efficiency and overall appearance integrity, while the double-level pluggable 15EDGKNH-3.5 terminals emphasize flexible configuration and maintainability. DEGSON can simultaneously provide complete 3D drawings for both I/O housings and terminals, enabling same-source supply of housings and terminals, and helping automation equipment manufacturers efficiently complete the hardware design of high-density I/O modules.
